M5 ULTRA

Apple M5 Ultra Benchmark & Thermal Headroom Simulator

Silicon Architecture
Ultra-Fusion 3nm
Silicon Presets
Multi-Die Ultra-Fusion Link 819.2 TB/s
Die A (M5 Max)
16P + 8E | 64 GPU
FUSION
Die B (M5 Max)
16P + 8E | 64 GPU
Performance Cores 32 Cores
Efficiency Cores 16 Cores
GPU Compute Units 128 Cores
Unified Memory Pool 256 GB
Interconnect Bandwidth (TB/s) 819.2 TB/s
Cooling & Thermal TDP 220 W
Geekbench 6 Multi-Core CPU
34,800
+62% vs M3 Ultra
Geekbench 6 Single-Core CPU
3,950
Next-gen N3P peak boost
Metal Compute Score GPU
245,000
Ray tracing & mesh shaders
Efficiency Rating Perf/Watt
Extreme Performance-per-Watt
Optimal Sustained
Cross-Generation Silicon Benchmarks
Simulated against M4 Max & M3 Ultra reference systems
Sustained Workload Thermal Headroom
45% Saturation (Safe)
Low Fan RPM (Quiet) Acoustic Knee Thermal Throttling Limit

M5 Ultra Multi-Die Scaling & Thermal Throttling

Read the explanation

The M5 Ultra links dual silicon dies across a high-speed Ultra-Fusion interconnect, aggregating CPU and GPU compute cores into a single unified architecture. Total power demand scales directly with active cores. If demand outpaces the cooling envelope, the simulator dynamically engages thermal throttling to preserve stability. Selecting a workstation preset or toggling a sustained stress test forces total heat beyond TDP limits, visibly lowering compute efficiency.

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