Hyperscale Data Center Fluid Cooling & Power Grid Simulator

Multi-Megawatt AI Infrastructure Thermodynamic Workbench
Configuration Presets & Loads
Direct-to-Chip Liquid Cooling
Cold plates directly on GPU/CPU dies. High efficiency.
Two-Phase Immersion Cooling
Servers submerged in dielectric fluid. Extreme heat density.
Evaporative Air Chiller Loop
Traditional forced air with CRAH units. Lower density limit.
Cluster Power Output 100 MW
Rack Density 40 kW/rack
Coolant Flow Rate 1200 GPM
Ambient Inlet Temp 25 °C
Grid Voltage 138 kV
LIVE SCHEMATIC :: HIGH VOLTAGE SUBSTATION & LIQUID LOOP
Total Grid Draw: 112.00 MW
PUE: 1.120
Coolant ΔT: 12.80 °C
Chip Junction: 62.40 °C
Status: Optimal
System Telemetry Real-time
Power Usage (PUE)
1.12
Total Grid Draw
112 MW
Coolant Delta-T
12.8 °C
Chip Junction Temp
62.4 °C
Thermal Safety Status
Optimal Operating Range
Thermodynamic Insight:

Direct liquid cold plates maintain chip junction temperatures well below the 85°C thermal throttling ceiling. Substation transformers are operating within safe peak load thresholds.

Energy Footprint Summary:
HV Substation Stepdown: 1.12 MW loss
HVAC / Pump Overhead: 10.88 MW
Effective Heat Rejected: 100.00 MW
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