Hardware Gadget RFQ & Assembly Architecture Modeler

Mechanical Exploded Cross-Section

Drag layers to inspect tolerances • Zoom / Click any element to audit layer specs

Exploded Separation: 28 mm

Form Factor Profile Ultra-slim <14mm desk profile

I/O & Power Harness DP Alt-Mode Single Cable validated

Passive Dissipation Chassis acts as heatsink (2.8W load)

1. Cover Glass & Optical Finish

Thickness: 1.1mm • Transmittance: 91% • Glare: 4%

2. Stretched-Bar Display Panel

Thickness: 3.2mm • Interface: 4-lane MIPI DSI / eDP

3. Compute / Controller Architecture

PCB: 4-Layer 1.2mm • Single-cable USB-C DP Alt Mode Native

4. Enclosure & Chassis Material

Wall: 1.8mm • Natural passive thermal spreader

5. Desk / Monitor Mounting System

4x N52 countersunk magnets integrated in rear housing

Selected: Dedicated USB-C DP Alt-Mode ASIC Bridge (Realtek RTD2556)

Single-chip scalar bridge converting USB Type-C DisplayPort Alternate Mode directly to dual-channel LVDS / eDP / MIPI for the stretched-bar panel. Eliminates OS overhead, boot latency (instant ON < 0.6s), multi-cable nests, and bulky carrier PCBs.

BOM Costing & CM RFQ Readiness

READY FOR CM RFQ

Unit BOM Cost

$46.80

COGS @ 2,500 pcs

Total NRE / Tooling

$24,500

Molds, Jigs & Certs

Rec. KS MSRP

$129.00

2.75x Margin Floor

Subsystem / Part Name	Type	Qty	Ext. Cost

Non-Recurring Engineering (NRE) & Certification Budget

CM Quoting Readiness (The 4 Non-Negotiables) 4 of 4 Ready

1. Mechanical Envelope & 3D Bounding Box: 242.0 × 68.0 × 11.4 mm outer envelope with draft angles & magnet pockets

2. System Architecture Block Diagram: Single-port USB-C PD Sink (5V/3A) + DP 1.4 RX to Realtek RTD2556 ASIC to 4-lane MIPI

3. Preliminary Indented BOM with Target ICs: Vendor part numbers for ASIC, stretched LCD panel, flex cable, and N52 magnets

4. Target Technical Specification Sheet: Environmental operating range, drop test spec (0.8m), FCC Part 15B / CE compliance class