Substrate & Die Package Micro-Viewer
Broadcom Lexus/Nexus
Laser Markings
2.5D CoWoS Interposer
8x HBM3e Stacks
Dual Compute Dies (Lexus/Nexus)
Package Provenance Decoded: Date code
260224 confirms physical packaged silicon arrived from TSMC/ASE on Feb 24, 2026. Broadcom co-design markings (Lexus compute + Nexus interconnect) prove OpenAI operated production ASICs for 182 days of board validation and frontier model tuning before public benchmarks.
182-Day Bring-Up Timeline & Validation Log
Validation & Co-design
Frontier Model Inference Simulator
Custom ASIC vs GPU Baselines
| Metric | Baseline GPU | Jalapeño ASIC | Advantage |
|---|---|---|---|
| Time to First Token (TTFT) | 48.2 ms | 18.4 ms | 2.62x faster |
| Throughput (tok/sec/chip) | 1,240 | 3,534 | 2.85x speedup |
| Memory Bandwidth Saturation | 94.8% (Capped) | 61.2% (Headroom) | +1.85 TB/s free |
| Cost per 1M Generated Tokens | $0.82 | $0.29 | -64.2% TCO |