Projected U.S. Output
1,425,000
GB/mo
High-Bandwidth & DRAM capacity
Estimated Cost per Gigabit
$1.42
Subsidized domestic fab cost
Supply Resilience Score
84.5
/ 100
Domestic autonomy index
Active Bottleneck
Packaging Yield
Primary throughput constraint
Interactive Manufacturing & Packaging Flow Network
Click node to inspect telemetry
1. Raw Wafers & Silane
2. Intel Wafer Fab (Ohio/Oregon)
3. SK Hynix Advanced Packaging (Indiana)
4. U.S. AI & Cloud Delivery
Node Telemetry: SK Hynix Advanced Packaging
| Facility Profile | West Lafayette Advanced Packaging |
| Throughput Rate | 1,425,000 GB/month eq. |
| Yield / Efficiency | 92.5% yield |
| Node Status | Bottleneck Stage |
Simulation Telemetry & Economics
| Active System Nodes | 4 Verified Nodes |
| CHIPS Act Subsidy Effect | -$0.47 / GB net offset |
| Domestic Sourcing Ratio | 78.2% Total BOM |
| Target Memory Type | DRAM/HBM3e Stack |