Capital Allocation ($3.5B)
$3,500M
Subsidies
Infra
Packaging R&D
Fab Equipment Subsidies (EUV/Tools)
$1,500M
Power & Water Infrastructure
$1,200M
Next-Gen Packaging R&D (HBM)
$800M
Supply Chain Bottlenecks
Grid Power Supply Delay
6 mo
EUV Tool Lead Time
14 mo
Water Supply Utility Capacity
85%
Mega Hub Activations
Yongin Mega Cluster (300mm Fabs)
Pyeongtaek Expansion Hub
Cheonan Advanced Packaging Hub
Semiconductor Supply Chain Network Node Topology
LIVE D3 SYSTEM FLOW
Mega Hubs
Utilities (Power/Water)
Equipment & Substrates
Active Wafer Flow
Computed Fab Outcomes
MODEL ACCELERATION
Activation Target
2027.8
-1.2 Yrs vs Base
Wafer Capacity
485k
Wafers / Month
Grid Utility Load
78.4%
Stable Supply
Global Share Delta
HBM & Foundry
Strategic Blueprint Evaluation
OPERATIONAL OPTIMAL
The $3.5B deployment achieves optimal balance between Yongin power grid buildout and Cheonan HBM packaging R&D. EUV lead times are offset by $1.5B tooling subsidies, positioning cluster activation for Q4 2027.
Exportable Data Schema
{
"fund_allocation_m": 3500,
"hubs": ["yongin", "pyeongtaek"],
"activation_year": 2027.8
}