Silicon & System Parameters
N3E (3nm TSMC)
Lithography determines thermal density, frequency headroom, and wafer pricing.
15 W
Sustained power budget for CPU+GPU die. Handheld ergonomics cap heat at 15-20W.
4.0 hrs
Continuous load hours determine required Wh capacity and chassis weight.
128 GB/s
LPDDR5X/LPDDR6 bus width. Memory starvation is the primary bottleneck for APU graphics.
Adds hardware intersection logic, raising silicon area and die cost.
Feasibility Telemetry & Horizon
LIVE SIMULATION
Performance Uplift
145%
vs Steam Deck LCD
Estimated COGS
$449
Bill of Materials
Battery & Chassis
669 g
60 Wh Pack
Thermal Headroom
18 W
Cooler Max Limit
Architectural Specification Brief