Forensic Layer Cross-Section (iFixit Verified)
Cross-Section: 100%
Hardware Component Parity Diagnostics:
Motherboard PCB Layout
Identical PCB traces
Identical screw-hole tolerances, shield anchors, and ribbon socket pitch to HTC donor handset.
FCC ID & Regulatory Mark
Re-badged OEM label
Adhesive label applied directly over original HTC internal serial stamping noted by iFixit.
SoC / Processor
Qualcomm Snapdragon
Mid-tier silicon package match; thermal dissipation pad dimensions byte-identical.
Chassis Extrusion
Unchanged mold tooling
Bevel radii, antenna line bands, and SIM tray cutout confirm single OEM supply line.
Markup Telemetry & Evidence Audit
Source: Engadget / iFixit
Component Parity Match
94.5% Identical Chassis & PCB
Composite structural & silicon layout score
Consumer Markup Rate
83.3% Price Increase
+$250 hike over original estimate
Verified Rebrand & Markup
$250 hike applied with identical HTC hardware baseline
Retail Pricing & Rebrand Premium Modeling:
HTC Baseline Hardware Retail
Equivalent HTC market value estimate
Trump Mobile T1 Retail Price
Published retail MSRP after price hike
Teardown Parity Weight (PCB/Chassis)
Observed parts overlap coefficient
94.5%
Base Value ($300)
Branding Surcharge (+$250)
EVIDENCE DOSSIER (LIVE CAPTURE)
Ready for download