Mechanical Cross-Section Physics
Bending Radius: 3.20 mm
Tensile Stress: 142 MPa
Chassis Gap: 0.02 mm
Pocketability Score
91
Thinness & volume index (0–100)
Crease Visibility
Ultra-Low
Depth: 38 µm @ 3.2mm hinge
Structural Integrity
8.8
Hinge torque & chassis rigidity
Hardware Form-Factor Controls
4.65 mm
Chassis single-wing depth
3.2 mm
Internal teardown bend curvature
38 µm
Optical micro-indentation on UTG
5100 mAh
Silicon-Carbon dual anode cells
| Specification Dimension | Xiaomi Rival Concept | Apple Foldable Rumor |
|---|---|---|
| Unfolded Thickness | 4.65 mm | ~4.5 mm Patent/Supply |
| Folded Total Profile | 9.32 mm | ~9.00 mm Kuo Spec |
| Internal Hinge Radius | 3.20 mm | ~3.00 mm (Liquidmetal) |
| Crease Depth & Rating | 38 µm (Ultra-Low) | <45 µm (Speculative) |
| Battery Configuration | 5100 mAh (Dual Si-C) | ~5,400–5,800 mAh |
| Cover Screen Ratio | 20:9 (5.38" / 6.56" Sub) | ~5.5" Exterior Display |
| SoC Architecture | Snapdragon 8 Gen Elite / Xring O3 | Apple A20 Bionic (2nm) |
Engineering Tradeoff Insight
With a 3.2mm hinge radius and 4.65mm chassis thickness, the teardown architecture disperses mechanical shear stress beneath 150 MPa during complete 180° closure, preserving 38 µm crease fidelity without causing hinge bulging.
Verified Industry Context & Disclosures
Simulations and baseline parameters reference reporting by MacRumors and supply-chain analysis regarding Xiaomi's next-generation foldables engineered to preempt Apple's entry into the ultra-thin folding phone segment.
- Source: MacRumors Announcement Report
- Disclosures: Hardware metrics reflect representative engineering concept models and rumored Apple supply-chain leaks.
- Physics Engine: Matter.js kinematic spline calculation and Finite Element mechanical stress projection.