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Apple Nvidia Server Infrastructure Architect Enterprise Studio

Simulate thermal envelopes, power demand, throughput, and 3-year CapEx/OpEx for Apple-Nvidia AI pods

Topology Parameters

Physical & Electrical
16 racks
72 GPUs
Thermal Cooling Method Liquid
$0.08 / kWh
Compute Capacity
1152 GPUs
16 Racks × 72 per Rack
Total Power Envelope
1.48 MW
92.5 kW / Rack average
Cooling Demand
421.5 Tons
Direct-to-Chip Liquid CDI
Capital Expenditure
$ 48.38 M
3-Year Server & Fabric HW
Annual Operational Ex
$ 1.04 M
8,760 hrs @ $0.08/kWh
LLM Compute Speed
41500000 T/s
FP8 / FP4 Effective Throughput
Datacenter Pod Matrix Layout (Interactive Node Map)
Liquid Circuit Active
NVLink 5.0 Fabric
Thermal Envelope
Energy & Facility Load PUE 1.12
IT Accelerators & Memory 82%
Cooling & Heat Exchange 12%
Networking & Fabric Switching 6%
3-Year TCO Lifecycle $51.50M
Hardware CapEx (Racks + GPUs) 94%
3-Year Power & Utility OpEx 6%
Break-even inference cost estimated at $0.012 per 1M tokens.

Server Pod Spec Sheet Summary

Engineering Baseline v2.4
Component / Metric Specification Cluster Aggregated
Compute Accelerators Nvidia Blackwell B200 1,152 Units
Data Center Footprint 72 GPUs / 42U Rack 16 Physical Racks
Thermodynamics & Cooling Direct-to-Chip Liquid Cooling 421.5 Tons (1,482 kW Heat)
Electrical Load & Rate $0.08 / kWh Utility Tariff 1.48 MW Continuous
Financial Footprint 3-Yr Server Lifecycle $48.38M CapEx | $1.04M/yr OpEx
Live Spec State: Ready for Infrastructure Procurement Export apple-nvidia-server-spec.json
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