NVIDIA AI LG TECH

Robotics Power & Thermal Co-Design Workbench

Mission Workload Preset
Subsystem Parameters
NVIDIA AI Compute TDP 130 W
Actuator RMS Power (12-DOF) 180 W
Actuator Peak Dynamics 450 W
LG Battery Pack Capacity 1400 Wh
Pack Bus Voltage (Nominal) 48 V
Cooling Loop Capacity 220 W
Ambient Operating Temp 25 °C
Coupled Power & Thermal Co-Simulation Engine System Nominal
Continuous Mission Runtime
3.82 hrs
Total Pack Draw: 366.5 W
Compute Junction Temp (Tj)
64.5 °C
Headroom: +20.5 °C to throttle
System Power Delivery Eff.
89.4 %
Peak C-Rate: 0.41 C
48V DC COMMON POWER BUS (7.64 A RMS) LG CELL ARRAY Capacity: 1400 Wh Cell Temp: 31.2 °C IR Loss: 11.8 W NVIDIA AI COMPUTE TDP: 130 W Silicon Tj: 64.5 °C VLA Load: 100% ACTUATION ARRAY (12-DOF) RMS Load: 180 W Peak Peak: 450 W Inverter Eff: 95.0% ACTIVE MICROCHANNEL LIQUID COOLING LOOP Cooling COP: 3.20 Radiator Dissipation: 310.0 W Pump/Fan Draw: 44.7 W Rth (j-a): 0.304 °C/W Coolant Flow: 1.45 L/min
Co-Design Insight: Sizing humanoid robot power architectures requires simultaneous balance of AI compute TDP vs actuator peak back-EMF, battery IR self-heating ($I^2R_{pack}$), and active cooling COP. Increasing ambient temp directly compresses thermal headroom before Thor compute throttling kicks in at 85°C.
Engineering Subsystem Ledger
Subsystem Metric Value Status
Thermal Resistance Network
Rth_jc (Junction-Case): 0.080 °C/W
Rth_ch (Case-Heatsink): 0.045 °C/W
Rth_ha (Heatsink-Air): 0.179 °C/W
Total Rth (Junction-Amb): 0.304 °C/W
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